Static Dissipative Polyimide (B-718) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.
| Adhesive Type | Static Dissipative Permanent Acrylic |
| After Process | Yes, this material will work with this application |
| Application | Circuit Board Labeling |
| Approval/Compliance (EMEA) | UL Recognised, ANSI/ESD S541-2008 (between 10 and 10 ohms) for dissipative ESD packaging materials, MIL-STD-202 Method 215K |
| Board Application | Through Hole Technology - Top, Through Hole Technology - Bottom, Surface Mount Technology (SMT) - Top/Bottom, After Process, Static Dissipative |
| Brady Material Number | B-718 |
| Color | White |
| Compatible Surface Types | High Surface Energy |
| Continuous or Die-cut | Die-cut |
| Corner Type | Rounded |
| Dimensions (imperial) | 0.4 in H x 0.4 in W |
| Dimensions (metric) | 10,16 mm (W) x 10,16 mm (H) |
| Enables Industry Compliance (North America) | UL 969, ANSI/ESD S541-2008, MIL-STD-202G, Method 215K Resistance to Solvents |
| Finish | Gloss |
| Height (imperial) | 0.4 in |
| Height (metric) | 10.16 mm |
| Indoor or Outdoor Use | Indoor Use |
| Industry | Aerospace, Automotive, Electronics, Manufacturing |
| Industry Compliance MIL_STD | MIL-STD-202G, Method 215K |
| Industry Compliance UL | UL969 |
| Label Properties | Heat Resistant, Permanent Adhesive, Electrostatic Dissipative |
| Label/Tape Size (imperial) | 0.4 in H x 0.4 in W |
| Label/Tape Size (metric) | 10.16 mm H x 10.16 mm W |
| Material | Polyimide |
| Material Properties | Low Profile, Static-dissipative, Harsh Flux Wash-resistant |
| Material Type | Polyimide |
| Maximum Service Temperature (°C) | 300 °C |
| Maximum Service Temperature (°F) | 572 °F |
| Minimum Service Temperature (°C) | -70 °C |
| Minimum Service Temperature (°F) | -94 °F |
| Performance Characteristics | Abrasion resistance, High heat resistance, Low temperature resistance, Solvent/Chemical resistance, Electrostatic dissipative |
| Primary Noun, Basic Function.1 | Label |
| Print Technology | Thermal Transfer |
| Printer Compatibility | M710, BMP71 |
| Printer and Label Applications | Circuit Board, General Identification |
| Printer supply or Pre-printed | Printer supply |
| Quantity per Roll | 500 |
| Quantity per Row | 1 |
| Recommended Ribbon | M7-R6000 |
| Recommended Ribbon Series | R6000HF |
| Resistance Properties | Abrasion-resistant, Chemical-resistant, Corrosion-resistant, Humidity-resistant, UV-resistant, Weather-resistant |
| Ribbon Series | R6000HF |
| SAP B-Number | B-718 |
| SAP Local Description | M7-4-718 |
| Service Temperature Range (°C) | -70 °C - 300 °C |
| Service Temperature Range (°F) | -94 °F - 572 °F |
| Shape | Square |
| Smart Cell | Yes |
| Surface Mount Technology SMT | Yes, this material will work with this application |
| Thickness (imperial) | 0.0033 in |
| Thickness (metric) | 0.084 mm |
| Through Hole Technology | Top: Yes, Bottom: Yes |
| Total Quantity | 500 |
| Trade Name | UltraTemp |
| Vertical Repeat (imperial) | 0.525 in |
| Vertical Repeat (metric) | 13.34 mm |
| Web Width (imperial) | 0.812 in |
| Web Width (metric) | 20.62 mm |
| Width (imperial) | 0.4 in |
| Width (metric) | 10.16 mm |