Static dissipative polyimide labels withstand wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.
| Adhesive Type | Static Dissipative Permanent Acrylic |
| After Process | Yes, this material will work with this application |
| Application | Circuit Board Labeling |
| Approval/Compliance (EMEA) | UL Recognised, ANSI/ESD S541-2008 (between 10 and 10 ohms) for dissipative ESD packaging materials, MIL-STD-202 Method 215K |
| Board Application | Through Hole Technology - Top, Through Hole Technology - Bottom, Surface Mount Technology (SMT) - Top/Bottom, After Process, Static Dissipative |
| Brady Material Number | B-719 |
| Color | White |
| Compatible Surface Types | High Surface Energy |
| Continuous or Die-cut | Die-cut |
| Core Diameter (imperial) | 3 in |
| Core Diameter (metric) | 76.20 mm |
| Corner Type | Rounded |
| Dimensions (imperial) | 0.187 in H x 1 in W |
| Dimensions (metric) | 25,40 mm (W) x 4,75 mm (H) |
| Enables Industry Compliance (North America) | UL 969, ANSI/ESD S541-2008, MIL-STD-202G, Method 215K Resistance to Solvents |
| Finish | Matte |
| Format | IP Enabled |
| Height (imperial) | 0.187 in |
| Height (metric) | 4.75 mm |
| Indoor or Outdoor Use | Indoor Use |
| Industry | Aerospace, Automotive, Electronics, Manufacturing |
| Industry Compliance MIL_STD | MIL-STD-202G, Method 215K |
| Industry Compliance UL | UL969 |
| Label Properties | Heat Resistant, Permanent Adhesive, Electrostatic Dissipative |
| Label/Tape Size (imperial) | 0.187 in H x 1 in W |
| Label/Tape Size (metric) | 4.75 mm H x 25.40 mm W |
| Material | Polyimide |
| Material Properties | Low Profile, Static-dissipative, Harsh Flux Wash-resistant |
| Material Type | Polyimide |
| Maximum Service Temperature (°C) | 300 °C |
| Maximum Service Temperature (°F) | 572 °F |
| Minimum Service Temperature (°C) | -70 °C |
| Minimum Service Temperature (°F) | -94 °F |
| Patent Number(s) | 5958537 |
| Patent Valid in (Countries) | USA |
| Performance Characteristics | Abrasion resistance, High heat resistance, Low temperature resistance, Solvent/Chemical resistance, Electrostatic dissipative |
| Primary Noun, Basic Function.1 | Label |
| Print Technology | Thermal Transfer |
| Printer Compatibility | BBP81, A8500, i5100, i6100, i7100, i7500, PR Plus, IP Series, THT 3 in Core Printers |
| Printer and Label Applications | Circuit Board, General Identification |
| Printer supply or Pre-printed | Printer supply |
| Quantity per Roll | 10000 |
| Quantity per Row | 1 |
| Recommended Ribbon | i75-R6006, IP-R6006, R6006 |
| Recommended Ribbon Series | R4700, R6000HF |
| Resistance Properties | Chemical-resistant, Fluid-resistant, High Temperature-resistant |
| Ribbon Series | R6000HF |
| SAP B-Number | B-719 |
| SAP Local Description | THT-42-719-10 |
| Service Temperature Range (°C) | -70 °C - 300 °C |
| Service Temperature Range (°F) | -94 °F - 572 °F |
| Shape | Rectangle |
| Smart Cell | No |
| Surface Mount Technology SMT | Yes, this material will work with this application |
| Thickness (imperial) | 3.3 mil |
| Thickness (metric) | 0.084 mm |
| Through Hole Technology | Top: Yes, Bottom: Yes |
| Total Quantity | 10000 |
| Trade Name | UltraTemp |
| Vertical Repeat (imperial) | 0.287 in |
| Vertical Repeat (metric) | 7.29 mm |
| Web Width (imperial) | 1.2 in |
| Web Width (metric) | 30.48 mm |
| Width (imperial) | 1 in |
| Width (metric) | 25.40 mm |
